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Precision Carrier Rings for Secure Wafer Handling and Processing
CCD Enterprise offers high-quality Wafer Rings engineered for 5-inch, 6-inch, and 8-inch wafers, ensuring safe handling, support, and alignment during semiconductor manufacturing, dicing, backgrinding, and packaging processes. Our wafer rings are made from cleanroom-compatible, dimensionally stable materials that meet the strict requirements of IC assembly, wafer dicing, and die sorting operations.
Available in standard and custom dimensions, CCD’s wafer rings ensure flatness, rigidity, and consistent performance, helping maintain wafer integrity throughout automated or manual workflows.
Key Features
Available Sizes:
5-inch (125mm)
6-inch (150mm)
8-inch (200mm)
Material Options:
Antistatic plastic
Conductive plastic
Cleanroom-grade engineering polymers
Surface: Smooth or textured finish
Flatness & Rigidity: Engineered to prevent warping and edge damage
Customization:
Inner/outer diameter modifications
Private label or part coding
Available with wafer tape upon request
Applications
Wafer dicing & backgrinding
Die attach and pick & place
Wafer probing, sorting, and inspection
Semiconductor packaging lines
Tape frame integration
