JEDEC Labels

Industry-Standard Labels for Moisture-Sensitive & ESD-Safe Packaging

CCD Enterprise supplies JEDEC-compliant Labels for proper identification of moisture-sensitive and electrostatic-sensitive devices during storage, shipment, and reflow soldering processes. These labels meet JEDEC J-STD-033 and J-STD-020 standards, ensuring that components packaged in moisture barrier bags (MBB) are handled correctly and protected from moisture and ESD damage.

Printed with standardized warnings, barcodes, moisture sensitivity levels (MSL), and bake dates, our JEDEC labels are a key component of your MSD handling SOP and dry pack process.

Label Types Available
MSL Labels (Moisture Sensitivity Level)

ESD Caution Labels (ANSI/ESD S8.1)

Peak Reflow Temperature Labels

Dry Pack Labels (with part number, lot, date, etc.)

Bake Labels (to track pre-reflow drying)

Key Features
Material: Thermal transfer or laser-printable PET or paper

Adhesive: Permanent or cleanroom low-residue

Print Options:

Blank or pre-printed with JEDEC-compliant fields

Custom part number, barcode, MSL, and logos available

Sizes:

50 x 75 mm (standard)

60 x 80 mm (custom available)

Color: Standard black on white/yellow; full color optional

Compliance: JEDEC J-STD-033, J-STD-020, ANSI/ESD, RoHS

Applications
Semiconductor and SMT packaging

Moisture barrier bag sealing

Dry packing and vacuum sealing lines

Reflow solder tracking

Tray and reel moisture control labeling