Description
High-Precision, Durable Trays for Automated Component Handling
CCD Enterprise supplies Injection Moulded Trays engineered for the secure handling, transport, and packaging of semiconductor components, electronic devices, and precision parts. Manufactured using high-precision molds, these trays offer exceptional dimensional accuracy, repeatability, and mechanical strength?ideal for use in high-speed automation and cleanroom environments.
Available in conductive, antistatic, or insulating materials, our trays are fully customizable in cavity layout, tray dimensions, and material properties to meet specific application requirements.
Key Features:
Precision-molded from conductive, antistatic, or standard thermoplastics
High dimensional stability and cavity accuracy
Customizable tray size, cavity shape, depth, and layout
Compatible with JEDEC standards or custom footprints
Stackable and nestable for efficient storage and transport
Suitable for automated pick-and-place and robotic systems
Cleanroom-compatible and reusable
Applications:
Packaging and handling of ICs, sensors, modules, and microcomponents
Use in semiconductor assembly, SMT, and device testing
Wafer sort, die attach, and back-end processing
Ideal for EMS, OEM, and contract manufacturers requiring consistent tray performance

