Description
Adhesive-Free Immobilization for Thin and Fragile Devices
CCD Enterprise offers Gel-Pak AD Series Boxes, purpose-built to immobilize delicate components such as bare dies, thin chips, VCSELs, and small optical devices without the need for adhesives or mechanical clamps. These boxes feature a proprietary Gel-Pak “AD” (Adhesive-Free) gel membrane mounted on a plastic carrier, enclosed in a clear clamshell box for visibility and protection.
The AD Series provides consistent holding force, cleanroom compatibility, and safe handling for high-value, ultra-fragile parts in semiconductor and photonics environments.
Key Features:
Gel-coated membrane immobilizes components via surface tension (not adhesive)
Available in various gel tack levels (X0, X4, X8)
Reusable and contamination-free
Transparent hinged box for easy inspection
Available in standard sizes (1″, 2″, 4″, etc.) or custom formats
Compatible with pick-and-place automation and vacuum handling tools
Cleanroom-compatible (ISO Class 5-7)
Applications:
Secure transport and storage of thin dies, MEMS, LEDs, and laser chips
Precision immobilization during metrology, inspection, or testing
Semiconductor back-end packaging, photonics, and failure analysis labs
Engineering sample kits and R&D sample shippin
